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Inspects impurities and defects on material surfaces during various R2R printing processes

Impurities, pinhole, stain, scratches, etc.

Inspects printing status of patterns during various R2R print processing, e.g. film, MLCC

W〮L margin, impurities, pinholes, smearing, no print, and sheet folding

Measures application status and amount of application solution, e.g. resin, glue, PCB coating solution, and floor coating solution

Inspects impurities and defects of film coating layers during film printing processes

Impurities, pinholes, stains, scratches, etc.

The instrument measures the amount of travel that occurs during film conveying.

Measures film thickness with OCT technology and spectrum analysis algorithm (thin film/thick film)

Provides table-top, offline, in-line types